Thermal Grizzzly Intel Mycro Direct-Die Pro RGB 1700 (New Rev1)

Description

The latest revision as of Sept 2024!

The Intel Mycro Direct-Die Pro RGB V1 is an evolution of the Mycro Direct-Die series for the Intel LGA1700 platform. The optimizations in the Pro version allow for improved heat transfer of the CPU under load, achieving up to 6 degrees Celsius lower temperatures compared to the standard version of the Direct-Die water cooler. In addition to the technical improvements, the design has also been updated.

The most significant innovations involve the copper base plate, which now accommodates 43 percent more microfins thanks to an optimized slot width of the cooling channels and is equipped with both an inlet and outlet channel. Combined with a jet plate, the new cooler design offers overall lower flow resistance and can dissipate the processor’s heat under load more effectively than the non-Pro version.

The aluminum cover of the Intel Mycro Direct-Die Pro RGB V1 visually resembles the Intel Mycro Direct-Die V1, but it rests on a block of tempered acrylic glass. RGB LEDs in the aluminum cover illuminate the acrylic glass from within, creating a visually striking effect as the lighting shines through the sides between the nickel-plated base plate and the black anodized cover, as well as from the top around the G1/4-inch fittings, elegantly showcasing the water cooler.

Description:

The Intel Mycro Direct-Die Pro RGB V1 is equipped with a jet system on the cooler surface and the cooling channel slot width has been optimized. The coldplate of the cooler is made of nickel-plated copper and is mounted directly on the CPU chip. To do this, the Integrated Loading Mechanism (ILM) of the mainboard is removed and the processor must be delidded. The nickel-plating of the cooler plate creates a barrier layer so that gallium-based liquid metal cannot diffuse into the copper and multiple applications of liquid metal are generally not necessary.

Water cooler for direct-die mounting
Microfin cooler made of nickel-plated copper
Replaces ILM and heatspreader
Acrylic glass and aluminum cover
G1/4-inch connections
CPU compatibility list available online
Only for delidded CPUs! Attention: Loss of warranty!

Between the coldplate and the cover made of anodized aluminium is acrylic glass, which is subjected to a annealing process after milling, which relieves the acrylic glass of internal stresses. This ensures that no stress cracks form in the acrylic glass even after a long period of use, as can occur with tempered acrylic glass. RGB LEDs are located under the aluminum cover, which are controlled via the mainboard via a 3-pin ARGB header (+5V/DATA/GND). The LEDs illuminate the acrylic glass under the lid and the G1/4-inch connections in the lid.

Note on the use of KryoSheet

The Intel Mycro Direct Die Pro RGB V1 has been extensively tested internally in various application scenarios. During development, great emphasis was placed on stable operation of the processor and RAM. In our test series, KryoSheet in combination with the Intel Mycro Direct Die Pro RGB V1 was unable to achieve any significant improvements in terms of temperature and was problematic in terms of contact pressure. For this reason, we cannot recommend thermal pads because their additional thickness has a strong influence on the contact pressure and can therefore impair the function.

Compatibility note

The Intel Mycro Direct-Die Pro RGB V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs

Attention: Removing the heatspreader (“delidding”) of a processor is at your own risk! The manufacturer’s warranty expires when the CPU is delidded! Damage caused by delidding the CPU is not covered by the manufacturer’s warranty!

Removing the Integrated Loading Mechanism (ILM) of the mainboard may invalidate the manufacturer’s warranty of the mainboard manufacturer!

Scope of delivery