The benchmark-grandmaster Roman “der8auer” Hartung developed, and in version two improved upon the Delid Die Mate 2 solution. This solution allows anybody to easily, comfortably and safely remove the heat spreader without risking a premature end to a pricey purchase. Known as a CPU delidding tool and manufactured from black anodized aluminum with a laser-engraved der8auer logo, it allows the heat spreader to be removed risk-free in under a minute. The processor is placed into the Delid Die Mate 2 receptacle according to the arrow marking on the CPU, and a slider responsible for cutting the CPU is inserted and then slowly and evenly tightened by means of an Allen key which completely removes the heat spreader which is then separated from the processor. This method allows the removal process to be performed absolutely reliably and without risk of damage.
This previously dangerous act of DIY is turned into something routine and harmless, thereby guaranteeing that the CPU and the now accessible CPU components survive unscathed. This opens up completely new possibilities in the realm of CPU modding to extreme overclockers and their aspirational counterparts everywhere. The issue of additional heat transfer between the heat spreader and silicon has now disappeared and the CPU’s temperature falls precipitously as a consequence – even without any overclocking. An additional advantage is that a more premium thermal paste with improved conductivity can and should be chosen, for example, the offering from Thermal Grizzly. The results speak for themselves: Temperature reductions of 10 °C to 20 °C are achievable.
A popular alternative for some processor generations lies in the choice of Thermal Interface Material e.g. replacing it with a liquid metal thermal paste offering notably improved conductivity. This subsequently allows the heat spreader and a full cooler to be reattached as normal by means of silicon adhesive. To maintain reliable contact between the heat spreader and the CPU, the third component of the Delid Die Mate 2 is required, this is inserted over the receiving module and enacts a vice-like pressure from above. It should be ensured, however, that the amount of pressure applied is not excessive in order to prevent damage to the CPU.